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| 摘要: |
| 研究了高纯Ti和Cu62Zn38合金在不同的工艺条件下的扩散焊接性能和界面情况。结果表明，热等静压温度为510 ℃时，加工态Ti板硬度下降明显，与退火态Cu62Zn38接近；退火态Ti板和退火态Cu62Zn38两种材料硬度较为接近，而在温度接近525 ℃时，退火态Cu62Zn38合金硬度明显高于退火态Ti板。退火态Cu62Zn38合金与退火态高纯Ti经过焊接温度525 ℃，压力120 MPa，保温4 h的扩散焊接后，平均抗拉强度能达到136 MPa，焊接界面达到冶金结合，满足Ti靶材的使用要求。 |
| 关键词: 靶材 高纯Ti 扩散焊接 Cu62Zn38合金 |
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| Research on diffusion bonding technology of Ti target and Cu 62 Zn 38 alloy backplane for integrated circuit |
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Chen Ming 1, 2 , Dong Tingyi 1, 3 , Lü Jingbo 1, 3 , Yu Wenjun 2 , Lü Baoguo 1, 2, 3
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| Abstract: |
| The interfacial condition and joint properties of diffusion bonded high-purity Ti and Cu62Zn38 alloy joint were studied under different welding condition. The results showed that hardness of Cu62Zn38 and Ti was about the same when the hot isostatic pressing temperature was 510 ℃. Hardness of annealled Cu62Zn38 was higher than annealled Ti when the temperature rises to 525 ℃. The average tensile strength of sample can reach 136 MPa with the diffusion bonding temperature of 525 ℃ and hot isostatic press 120 MPa lasting for 4 hour. The welding interface of sample achieves metallurgical bonding and the joint properties of the sample can meet the requirements of Ti target. |
| Key words: target high purity titanium diffusion bonding Cu62Zn38 alloy |
